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product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays 1/23 datashee t tsz22111 ? 14 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0e3e0j500040-1-2 17.aug.2012 rev.001 www.rohm.com j built in vcxo, spread-spectrum clock generator bu3087fv description bu3087fv has built in vcxo that is necessary for the digital-tv signal reception. connecting 27mhz crystal oscillator generates clock signals to 74.25mhz for hi-vision. bu3087fv has built in spread-spectrum function too. features ? 3225 size crystal is usable ? on / off of spread-spectrum is selectable ? four kinds of modulation-rate is selectable 0.25% / 0.50% / 0.75% / 1.00% ? triangular modulation applications digital-tv, stb, tv-tuner key specifications ? crystal pullability 105ppm (typ.) ? modulation frequency 34.5khz (typ.) ? cycle-to-cycle jitter 180psec (typ.) ? operating current 45ma (typ.) ? operating temperature -10 to +75 package (typ.) (typ.) (max.) ssop-b16 5.00mm x 6.40mm x 1.35mm typical application circuit (caution) cl and rd in typical application circuit sh ould be optimized as to using crystal and board condition. ssop-b16 3.3v (typ.) 0.1 f xin a vdd1 a vss1 vctrl a vdd2 a vss2 modsel1 modsel2 xou t pdb clkou t vd d vss sson tes t clk27m 27mhz crystal cl cl rd 0.1 f 0.1 f figure 1. typical application circuit
2/23 datasheet d a t a s h e e t bu3087fv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com j tsz22111 ? 15 ? 001 tsz02201-0e3e0j500040-1-2 17.aug.2012 rev.001 block diagram 7:modsel1 with pull-up 10:test with pull-down 4:vctrl 1:xin 16:xout 14:clkout spread-spectrum pll 9:clk27m v cxo control logic 15:pdb with pull-up 11:sson with pull-up 8:modsel2 with pull-down pin configuration figure 2. block diagram figure 3.pin configuration (top view) xin a vdd1 a vss1 vctrl a vdd2 a vss2 modsel1 modsel2 xou t pdb clkou t vd d vss sson tes t clk27m 1 2 3 4 5 6 7 8 16 15 14 14 12 11 10 9
3/23 datasheet d a t a s h e e t bu3087fv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com j tsz22111 ? 15 ? 001 tsz02201-0e3e0j500040-1-2 17.aug.2012 rev.001 pin function table of spread-spectrum modulation 1pin_xin input frequency =27.000000mhz in the case of 11pin_sson=h, outputs it according to the following table. in the case of 11pin ? sson=l, outputs unmodulated clock. pin no. pin name function 1 xin crystal input terminal 2 avdd1 power supply for vcxo 3 avss1 gnd for vcxo 4 vctrl vcxo control input terminal 5 avdd2 power supply for pll-analog 6 avss2 gnd for pll-analog 7 modsel1 spread-spectrum modulation control terminal (refer to table of spread-spectrum modulation) with pull-up 8 modsel2 spread-spectrum modulation control terminal (refer to table of spread-spectrum modulation) with pull-down 9 clk27m 27.000000mhz output 10 test test terminal, with pull-down 11 sson spread-spectrum on off choice h on l off , with pull-up 12 vss gnd for pll-digital 13 vdd power supply for pll-digital 14 clkout 74.250000mhz output 15 pdb power-down control terminal, with pull-up 16 xout crystal output terminal modsel2 modsel1 clkout l l 74.250000mhz 0.25% modulation l h 74.250000mhz 0.50% modulation h l 74.250000mhz 0.75% modulation h h 74.250000mhz 1.00% modulation
4/23 datasheet d a t a s h e e t bu3087fv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com j tsz22111 ? 15 ? 001 tsz02201-0e3e0j500040-1-2 17.aug.2012 rev.001 absolute maximum ratings (ta=25c) parameter symbol ratings unit supply voltage vdd -0.3 to 4.0 v input voltage vin -0.3 to vdd+0.3 v storage temperature range tstg -55 to 125 c power dissipation pd 690 1 mw 1 a measure value at mounting on 70mm x 70mm x 1.6mm glass epoxy substrate. in the case of exceeding ta=25c, 6.9mw should be reduced per 1c. recommended operating ratings parameter symbol ratings unit supply voltage vdd 3.135 to 3.465 v input ?h? voltage vih 0.8vdd to vdd v input ?l? voltage vil 0.0 to 0.2vdd v operating temperature topr -10 to 75 c frequency control voltage vc 0.0 to vdd v output load cl 15 (max) pf 1 in case of output load exceeds previous value , consideration should be adapted rise time and fall time for condition of use.
5/23 datasheet d a t a s h e e t bu3087fv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com j tsz22111 ? 15 ? 001 tsz02201-0e3e0j500040-1-2 17.aug.2012 rev.001 electrical characteristics dc characteristics (vdd=3.3v, ta=25c, crystal frequency=27.000000mhz , at no load, unless otherwise specified parameter symbol limit unit conditions min. typ. max. output h voltage voh vdd-0.4 v ioh=4.0ma output l voltage vol 0.4 v iol=4.0ma operating circuit current idd 45.0 58.0 ma output no load, 0.50% modulation input h current 1 iuph -1.5 1.5 a pdb, sson, modsel1 terminal vih=vdd input h current 2 idnh 35.0 70.0 105.5 a modsel2, test terminal,vih=vdd input h current 3 idirh -1.5 1.5 a vctrl terminal,vih=vdd input l current 1 iupl -105.5 -70.0 -35.0 a pdb, sson, modsel1 terminal vil=0.0v input l current 2 idnl -1.5 1.5 a modsel2, test terminal,vil=0.0v input l current 3 idirl -1.5 1.5 a vctrl terminal,vil=0.0v clkout clkout 74.248144 74.250000 74.251856 mhz vctrl=1/2vdd crystal pullability fp 80 105 130 ppm 0 Q vctrl Q vdd 1 spread-spectrum modulation frequency fmod 32.5 34.5 36.5 khz triangular modulation, independently of modulation rate 1 this is a guarantee with only ic. it is finished with confirmation to operate with crystal (dsx321g ? 8pf load) made in daishinku corp. ac characteristics (vdd=3.3v, ta=25c, crystal frequency=27.000000mhz, output load=15pf, unless otherwise specified following the table cannot test directly on characte ristic when shipment, so it is a design guarantee. parameter symbol limit unit conditions min. typ. max. duty duty 45 50 55 % measured at 1/2vdd jitter 1 jssd 35 psec period jitter 1 2 , in spread-spectrum off jitter p-p jsabs 180 psec period jitter min-max value 2 , in spread-spectrum off jitter cycle-to-cycle jscycy 180 psec cycle-to-cycle jitter, in 0.50% modulation rise time tr 1.2 nsec time between 0.2vdd and 0.8vdd fall time tf 0.7 nsec time between 0.8vdd and 0.2vdd lock up time tlock 1 msec 3 jitter means center value when using japan tekt ronix : tds7104 digital phosphor oscilloscope. time between voltage supply leads to 3.135v and output clock gets stable. spread-spectrum modulation waveform modulation waveform is triangular. modulation rate is selectable among 0.25% 0.50% 0.75% 1.00%. in addition, modulation frequency is 34.5khz without depending on modulation rate. ( figure 4 shows 0.50% modulation waveform. ) 74.250000mhz 74.250000mhz x (100 + 0.5)% 74.250000mhz x (100 - 0.5)% modulation frequency 34.5khz figure 4. spread-spectrum modulation waveform
6/23 datasheet d a t a s h e e t bu3087fv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com j tsz22111 ? 15 ? 001 tsz02201-0e3e0j500040-1-2 17.aug.2012 rev.001 typical wave forms (vdd=3.3v, ta=25c, spread-spectrum off setting) time (5nsec/div.) figure 5. clk27m output waveform clk27m ( 500mv/div. ) time (1nsec/div.) figure 6. clk27m period-jitter clk27m (500mv/div.) time (5nsec/div.) figure 7. clkout output waveform clkout (500mv/div.) time (1nsec/div.) figure 8. clkout period-jitter clkout (500mv/div.)
7/23 datasheet d a t a s h e e t bu3087fv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com j tsz22111 ? 15 ? 001 tsz02201-0e3e0j500040-1-2 17.aug.2012 rev.001 typical performance curves (spread-spectrum off setting, output load=15pf) 0 20 40 60 80 100 120 140 160 180 3.1 3.2 3.3 3.4 3.5 supply voltage : vdd[v] period-jitter min-max : jsabs[psec] ta=25c figure 9. clk27m period-jitter min-max 0 20 40 60 80 100 120 140 160 180 -20 0 20 40 60 80 ambient temperature : ta[ ] period-jitter min-max : jsabs[psec] v dd =3.3v figure 10. clk27m period-jitter min-max 45 46 47 48 49 50 51 52 53 54 55 -20 0 20 40 60 80 ambient temperature : ta[ ] duty : duty[%] vdd=3.3v figure 12. clk27m duty figure 11. clk27m duty 45 46 47 48 49 50 51 52 53 54 55 3.1 3.2 3.3 3.4 3.5 supply voltage : vdd[v] duty : duty[%] ta=25c
8/23 datasheet d a t a s h e e t bu3087fv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com j tsz22111 ? 15 ? 001 tsz02201-0e3e0j500040-1-2 17.aug.2012 rev.001 typical performance curves (spread-spectrum off setting, output load=15pf) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 -20 0 20 40 60 80 ambient temperature : ta[ ] fall-time : tf[nsec] v dd =3.3v figure 16. clk27m fall-time 0.0 0.4 0.8 1.2 1.6 2.0 2.4 3.10 3.20 3.30 3.40 3.50 su ppl y vol tage : vd d [v] rise-time : tr[nsec] figure 13. clk27m rise-time ta=25c 0.0 0.4 0.8 1.2 1.6 2.0 2.4 -20 0 20 40 60 80 ambient temperature : ta[ ] rise-time : tr[nsec] v dd =3.3v figure 14. clk27m rise-time 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 3.10 3.20 3.30 3.40 3.50 su ppl y vol tage : vd d [v] fall-time : tf[nsec] figure 15. clk27m fall-time ta=25c
9/23 datasheet d a t a s h e e t bu3087fv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com j tsz22111 ? 15 ? 001 tsz02201-0e3e0j500040-1-2 17.aug.2012 rev.001 typical performance curves (spread-spectrum off setting, output load=15pf) 0 40 80 120 160 200 240 280 3.1 3.2 3.3 3.4 3.5 supply voltage : vdd[v] period-jitter min-max : jsabs[psec] ta=25c figure 17. clkout period-jitter min-max 0 40 80 120 160 200 240 280 -20 0 20 40 60 80 ambient temperature : ta[ ] period-jitter min-max : jsabs[psec] v dd =3.3v figure 18. clkout period-jitter min-max 45 46 47 48 49 50 51 52 53 54 55 -20 0 20 40 60 80 ambient temperature : ta[ ] duty : duty[%] vdd=3.3v figure 20. clkout duty 45 46 47 48 49 50 51 52 53 54 55 3.1 3.2 3.3 3.4 3.5 supply voltage : vdd[v] duty : duty[%] ta=25c figure 19. clkout duty
10/23 datasheet d a t a s h e e t bu3087fv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com j tsz22111 ? 15 ? 001 tsz02201-0e3e0j500040-1-2 17.aug.2012 rev.001 typical performance curves (spread-spectrum off setting, output load=15pf) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 -20 0 20 40 60 80 ambient temperature : ta[ ] fall-time : tf[nsec] v dd =3.3v figure 24. clkout fall-time 0.0 0.4 0.8 1.2 1.6 2.0 2.4 3.10 3.20 3.30 3.40 3.50 su ppl y vol tage : vd d [v] rise-time : tr[nsec] figure 21. clkout rise-time ta=25c 0.0 0.4 0.8 1.2 1.6 2.0 2.4 -20 0 20 40 60 80 ambient temperature : ta[ ] rise-time : tr[nsec] v dd =3.3v figure 22. clkout rise-time 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 3.10 3.20 3.30 3.40 3.50 su ppl y vol tage : vd d [v] fall-time : tf[nsec] figure 23. clkout fall-time ta=25c
11/23 datasheet d a t a s h e e t bu3087fv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com j tsz22111 ? 15 ? 001 tsz02201-0e3e0j500040-1-2 17.aug.2012 rev.001 typical wave forms (vdd=3.3v, ta=25c, spread-spectrum on setting) frequency (500khz/div.) figure 25. clkout0.25% modulation spectrum clkout ( 10db/div. ) frequency (500khz/div.) figure 27. clkout0.75% modulation spectrum clkout ( 10db/div. ) frequency (500khz/div.) figure 28. clkout1.00% modulation spectrum clkout ( 10db/div. ) frequency (500khz/div.) figure 26. clkout0.50% modulation spectrum clkout ( 10db/div. )
12/23 datasheet d a t a s h e e t bu3087fv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com j tsz22111 ? 15 ? 001 tsz02201-0e3e0j500040-1-2 17.aug.2012 rev.001 typical wave forms (vdd=3.3v, ta=25c, spread-spectrum on setting) clkout (60psec/div.) time (20 sec/div.) figure 29. clkout 0.25% modulation waveform time (20 sec/div.) figure 30. clkout 0.50% modulation waveform clkout (78psec/div.) time (20 sec/div.) figure 31. clkout 0.75% modulation waveform clkout (93psec/div.) time (20 sec/div.) figure 32. clkout 1.00% modulation waveform clkout (113psec/div.)
13/23 datasheet d a t a s h e e t bu3087fv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com j tsz22111 ? 15 ? 001 tsz02201-0e3e0j500040-1-2 17.aug.2012 rev.001 typical performance curves (spread-spectrum on setting, output load=15pf) modulation frequency has a same characteristic despite a modulation control. modulation rate has a same trend despite a control. 32.5 33.0 33.5 34.0 34.5 35.0 35.5 36.0 36.5 3.10 3.20 3.30 3.40 3.50 supply voltage : vdd[v] modulation-frequency : fmod[khz] figure 33. clkout 0.50% modulation frequency ta=25c 32.5 33.0 33.5 34.0 34.5 35.0 35.5 36.0 36.5 -20 0 20 40 60 80 ambient temperature : ta[ ] modulation-frequency : fmod[khz] v dd =3.3v figure 34. clkout 0.50% modulation frequency 0.40 0.42 0.44 0.46 0.48 0.50 0.52 0.54 0.56 0.58 0.60 3.10 3.20 3.30 3.40 3.50 supply voltage : vdd[v] modulation-rate [%] figure 35. clkout 0.50% modulation rate ta=25c 0.40 0.42 0.44 0.46 0.48 0.50 0.52 0.54 0.56 0.58 0.60 -20 0 20 40 60 80 ambient temperature : ta[ ] modulation-rate [%] v dd =3.3v figure 36. clkout 0.50% modulation rate
14/23 datasheet d a t a s h e e t bu3087fv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com j tsz22111 ? 15 ? 001 tsz02201-0e3e0j500040-1-2 17.aug.2012 rev.001 typical performance curves (spread-spectrum on setting, output load=15pf) 0 60 120 180 240 300 360 -20 0 20 40 60 80 ambient temperature : ta[ ] cycle-to-cycle jitte r : jscycy[psec] v dd =3.3v figure 40. clkout 0.50% modulation cycle-to-cycle jitter 0 60 120 180 240 300 360 3.1 3.2 3.3 3.4 3.5 supply voltage : vdd[v] cycle-to-cycle jitter : jscycy[psec] ta=25c figure 39. clkout 0.50% modulation cycle-to-cycle jitter 0 60 120 180 240 300 360 3.1 3.2 3.3 3.4 3.5 supply voltage : vdd[v] cycle-to-cycle jitter : jscycy[psec] ta=25c figure 37. clkout 0.25% modulation cycle-to-cycle jitter 0 60 120 180 240 300 360 -20 0 20 40 60 80 ambient temperature : ta[ ] cycle-to-cycle jitte r : jscycy[psec] v dd =3.3v figure 38. clkout 0.25% modulation cycle-to-cycle jitter
15/23 datasheet d a t a s h e e t bu3087fv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com j tsz22111 ? 15 ? 001 tsz02201-0e3e0j500040-1-2 17.aug.2012 rev.001 typical performance curves (spread-spectrum on setting, output load=15pf) 0 60 120 180 240 300 360 -20 0 20 40 60 80 ambient temperature : ta[ ] cycle-to-cycle jitte r : jscycy[psec] v dd =3.3v figure 44. clkout 1.00% modulation cycle-to-cycle jitter 0 60 120 180 240 300 360 3.1 3.2 3.3 3.4 3.5 supply voltage : vdd[v] cycle-to-cycle jitter : jscycy[psec] ta=25c figure 43. clkout 1.00% modulation cycle-to-cycle jitter 0 60 120 180 240 300 360 3.1 3.2 3.3 3.4 3.5 supply voltage : vdd[v] cycle-to-cycle jitter : jscycy[psec] ta=25c figure 41. clkout 0.75% modulation cycle-to-cycle jitter 0 60 120 180 240 300 360 -20 0 20 40 60 80 ambient temperature : ta[ ] cycle-to-cycle jitte r : jscycy[psec] v dd =3.3v figure 42. clkout 0.75% modulation cycle-to-cycle jitter
16/23 datasheet d a t a s h e e t bu3087fv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com j tsz22111 ? 15 ? 001 tsz02201-0e3e0j500040-1-2 17.aug.2012 rev.001 typical performance curves (spread-spectrum on setting, output load=15pf) vcxo crystal pullability has been gathered from following the evaluation environment. evaluation board: 70mm x 70mm x 1.6mm, 4 layers fr-4 using parts : 27mhz crystal (dsx321g ? 8pf load) made in daishinku corp. rd=200 , cl=4pf vcxo crystal pullability modulates by a using crystal and a board condition. in order to use, should be checked matting with a final board condition. -160 -120 -80 -40 0 40 80 120 0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3 vcxo-control-voltage : vctrl[v] crystal pullability : fp[ppm] vdd=3.3v, ta=25c figure 47. vcxo crystal pullability 40 44 48 52 56 60 3.1 3.2 3.3 3.4 3.5 supply voltage : vdd[v] operating current : icc[ma] ta=25c figure 45. operating current 40 44 48 52 56 60 -20 0 20 40 60 80 ambient temperature : ta[ ] operating current : icc[ma] v dd =3.3v figure 46. operating current
17/23 datasheet d a t a s h e e t bu3087fv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com j tsz22111 ? 15 ? 001 tsz02201-0e3e0j500040-1-2 17.aug.2012 rev.001 typical application circuit in the case of spread-spectrum modulation rate = 0.75% setting, 7pin_modsel1 connects gnd, and 8pin_modsel2 connect power supply directly following the diagram. in the case of other modulation rate setting, shoul d be changed connections as a table of spread-spectrum modulation (p3) . (in the case of 0.50% setting, it is no problem that 7pin_modsel1 and 8pin_modsel2 are open manages.) in the case of spread-spectrum off setting, 11pin_sso n connect gnd directly as the following diagram. (in the case of using spread-spectrum, it is no problem that 11pin_sson are open manages.) figure 48. modulation rate = 0.75% setting typical application circuit 3.3v (typ.) 0.1 f xin a vdd1 a vss1 vctrl a vdd2 a vss2 modsel1 modsel2 xou t pdb clkou t vd d vss sson tes t clk27m 27mhz crystal cl cl rd 0.1 f 0.1 f figure 49. spread-spectrum off setting typical application circuit 3.3v (typ.) 0.1 f xin a vdd1 a vss1 vctrl a vdd2 a vss2 modsel1 modsel2 xou t pdb clkou t vd d vss sson tes t clk27m 27mhz crystal cl cl rd 0.1 f 0.1 f
18/23 datasheet d a t a s h e e t bu3087fv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com j tsz22111 ? 15 ? 001 tsz02201-0e3e0j500040-1-2 17.aug.2012 rev.001 application information basically, mount ics to the printed circuit board for use. (if the ics are not mounted to the printed circuit board, the characteristics of ics may not be fully demonstrated.) mount 0.1f capacitors in the vicinity of the ic pins between 2pin_avdd1, 3pin_avss1, and 5pin_avdd2, 6pin_avss2, and 12pin_vss, 13pin_vdd respectively. to obtain accurate frequency, confirm the crystal-matching with the last board to get rid of a problem by a mass-production. depending on the conditions of the printed circuit board, mount an additional electrolytic capacitor between the power supply and gnd terminal. for emi protection, it is effective to put ferrite beads in the origin of power supply to be fed to bu3087fv from the printed circuit board or to insert a capacitor (of 1 or less), which bypasses high frequency desired, between the power supply and the gnd terminal. for ics with more than one power supply, it is possible that rush current may flow instantaneously due to the internal powering sequence and delays. therefore, give special c onsideration to power coupling capacitance, power wiring, width of gnd wiring, and routing of wiring. typical application circuit is recommendation, but in order to use, thoroughly check to be sure characteristic. power dissipation (ssop-b16 package) figure 50. power dissipation curve (pd-ta curve) * 70mm x 70mm x 1.6mm glass epoxy board 0 100 200 300 400 500 600 700 0 25 50 75 100 125 ambient temperature : ta [ ] power dissipation : pd [mw]
19/23 datasheet d a t a s h e e t bu3087fv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com j tsz22111 ? 15 ? 001 tsz02201-0e3e0j500040-1-2 17.aug.2012 rev.001 i/o equivalence circuit pin no. equivalent circuit schmitt-trigger pin 7, 11, 15 ( with pull-up ) 8, 10 ( with pull-down ) vcxo control input pin 4 clock output pin 9, 14 to ic inside to i c i n s i d e from ic inside from ic inside
20/23 datasheet d a t a s h e e t bu3087fv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com j tsz22111 ? 15 ? 001 tsz02201-0e3e0j500040-1-2 17.aug.2012 rev.001 i/o equivalence circuit pin no. equivalent circuit crystal input pin 1 crystal output pin 16 to i c i n s i d e from ic inside from ic inside
21/23 datasheet d a t a s h e e t bu3087fv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com j tsz22111 ? 15 ? 001 tsz02201-0e3e0j500040-1-2 17.aug.2012 rev.001 operational notes (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify br eaking mode such as a short circuit or an open circuit. if any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) operating conditions these conditions represent a range within which characteristics can be provided approximately as expected. the electrical characteristics are guaranteed under the conditions of each parameter. (3) reverse connection of power supply connector the reverse connection of power supply connector can br eak down ics. take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the ic?s power supply terminal. (4) power supply line design pcb pattern to provide low impedance for the wiring between the power supply and the gnd lines. in this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. for the gnd line, give consideration to design the patterns in a similar manner. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply and the gnd terminal. at the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to b e used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) gnd voltage make setting of the potential of the gnd terminal so that it will be maintained at the minimum in any operating state. furthermore, check to be sure no terminals are at a potential lower than the gnd voltage including an actual electric transient . (6) short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of the ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the gnd terminal, the ics can break down. (7) operation in strong electromagnetic field be noted that using ics in the strong electromagnetic field can malfunction them. (8) inspection with set pcb on the inspection with the set pcb, if a capacitor is connected to a low-impedance ic terminal, the ic can suffer stress. therefore, be sure to discharge from the set pcb by each process. furthermore, in order to mount or dismount the set pcb to/from the jig for the inspection process, be sure to turn off the power supply and then mount the set pcb to the jig. after the completion of the inspection, be sure to turn off the power supply and then dismount it from the jig. in addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set pcb. (9) input terminals in terms of the construction of ic, parasitic elements are inevitably formed in relation to potential. the operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the gnd respectively, so that any parasitic element will operate. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the ic. in addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) ground wiring pattern if small-signal gnd and large-current gnd are provided, it will be recommended to separate the large-current gnd pattern from the small-signal gnd pattern and establish a single ground at the reference point of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal gnd. pay attention not to cause fluctuations in the gnd wiring pattern of external parts as well. (11) external capacitor in order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to dc bias and changes in the capacitance due to temperature, etc. (12) thermal design perform thermal design in which there are adequate margins by taking into account the power dissipation (pd) in actual states of use. status of this document the japanese version of this document is formal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority.
22/23 datasheet d a t a s h e e t bu3087fv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com j tsz22111 ? 15 ? 001 tsz02201-0e3e0j500040-1-2 17.aug.2012 rev.001 ordering information physical dimension tape and reel information marking diagram b u 3 0 8 7 f v - e 2 part number package fv : ssop-b16 packaging and forming specification e2: embossed tape and reel ssop-b16(top view) 3087f part number marking lot numbe r 1pin mark (unit : mm) ssop-b16 4.4 0.2 6.4 0.3 1.15 0.1 9 8 16 1 0.10 0.65 0.3min. 5.0 0.2 0.22 0.1 0.15 0.1 0.1 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin
23/23 datasheet d a t a s h e e t bu3087fv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com j tsz22111 ? 15 ? 001 tsz02201-0e3e0j500040-1-2 17.aug.2012 rev.001 revision history date revision changes 17.aug.2012 001 new release
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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